Die Protection System

Micron is the most advanced die protection system available to the stamping industry

Micron Die Protection Unit with 2 Additional Channels
The Low Cost Solution For:
  • Misfeeds
  • Slug detection
  • Material changes
  • Stroke deviation
  • Mis-alignment between punch and die
  • Broken punch or die assemblies

Micron is the most advanced die protection system available to the stamping industry. With precise accuracy to .00004 inches (1/1000mm), Micron die protection monitors separation gap between the upper and lower dies. By monitoring these subtle deviations in stripper position or die height, Micron detects misfeeds, pulled slugs, double hits or other abnormal conditions that cost you time and money. The Micron system can be applied to any forming operation with speeds up to 2500 machine cycles per minute. No external timing sensors or machine calibration is required.

Micron Detects Misfeeds, Pulled Slugs, Double Hits and Other Abnormal Conditions

Micron detects separation gap to within .00004 inches.

Easy to use, limits are set automatically

The Micron die protection system features a unique adaptive learn and control circuit for establishing the proper displacement alarm setpoints. Once the machine is at production speed, the upper and lower limits are automatically adjusted based on your forming process. These limits are set as close as possible without causing nuisance, no alarm shutdowns. Built-in control relays activate machine stop circuits if an off-tolerance condition occurs. Up to seven additional channels can be added to each base unit for a total of eight channels of monitoring

Micron Die Protection System Stack Die Protection Sensor and Target

Each stack includes one channel of monitoring with high and low limits (left)
HMIC-R Sensor and Target (right)

Specifications
Power Requirements115VAC±10%
Power Consumption30 watts
Output contacts1 NO-NC, 250vac 5A rating
Response timeless than 10Msec.
Operating speedUp to 2500 SPM
RepeatabilityTo .00004 inches
Operating temperature-10°C to 50°C
Alarm adjustment±99 Microns
Sensor typeProximity 200 KHZ
Maximum sensing distance.1 inch (2.5mm)
Enclosure sizeBase 8.25" x 9.50"d x 3.25"h
Stack 8.25" x 9.50"d x 4.75"h

Ordering Information

ModelDescription
HMIC-BBase unit with one channel of monitoring sensor, power supply and machine stop relay
HMIC-KStack for additional channel of monitoring. Maximum of seven stacks per one base unit. Each stack supplied with sensor and ribbon connect cable.
HMIC-RProximity sensor supplied with pigtail cable, connector, target assembly and mounting brackets.